MEL-2208Model Form
MEL-2208 Epoxy Lamination Paste
A low-density (0.8 g/cm³) lamination paste with 115 °C resistance, applied up to 25 mm in a single pass.
Applications
- Reinforcing molds and ancillary parts
- Back-fill
- Checking gauges and fixtures
Key features
- Low density
- 115 °C temperature resistance
- Up to 25 mm application thickness
- Long working time