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Model Form
MEL-2203Model Form

MEL-2203 Epoxy Lamination Resin

A 130 °C lamination resin with low viscosity and excellent wet-out. The same resin runs infusion when paired with MEH-2970-3.

Applications

  • Laminated molds
  • RTM / RIM tooling
  • Glass or carbon fibre applications
  • Resin infusion

Key features

  • 130 °C temperature resistance
  • Unfilled, low viscosity
  • Excellent wet-out
  • Fast and slow hardener options